全部
(99.5%)
(99.999%)
(99.9999%)
(99+%)
100 μg/mL in Water, tr Hydrofluoric acid
100%
1000 μg/g in 75 cSt Base oil
1000 μg/mL in Water, tr Sodium hydroxide, tr Hydrofluoric acid
1000 μg/mL in Water, tr Hydrofluoric acid
10000 μg/mL in Water, tr Hydrofluoric acid
5000 μg/g in 75 cSt Base oil
95%%+
98.4%
98%
99.5%
99.9%
99.99%
99.9985%
99.999%
99.999+%
99.9999%
99%
99+%
min. 97%
nanopowder, <100?nm particle size (TEM), ≥98% trace metals basis
pieces, 99.95% trace metals basis
powder, ?325?mesh, 99% trace metals basis
powder, ?60?mesh, 99.999% trace metals basis
sphere, 10pcs, diameter 2.0mm, precision sphere grade 25
sphere, 20pcs, diameter 2.0mm, precision sphere grade 25
sphere, 50pcs, diameter 2.0mm, precision sphere grade 25
sputtering target, diam. × thickness 2.00?in. × 0.25?in., 99.999% trace metals b
wafer (single side polished), <100>, N-type, contains No dopant, diam. × thickne
wafer (single side polished), <100>, N-type, contains phosphorus as dopant, diam
wafer (single side polished), <100>, P-type, contains boron as dopant, diam. × t
wafer (single side polished), <111>, N-type, contains No dopant, diam. × thickne
wafer (single side polished), <111>, P-type, contains boron as dopant, diam. × t
wafer (single side polished), contains phosphorus as dopant, <111>, N-type, diam
wafer, <111>, P-type, contains boron as dopant, diam. × thickness 2?in. × 0.5?mm