双（乙酰乙酸叔丁酯）铜(II), 99% , 99%
Bis(t-butylacetoacetato)copper(II), 99%
分子式: C??H??CuO
分子量: 377.92
纯度: 99%
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Technical Notes:
1.A new, non-fluorinated, copper CVD precursor exhibiting a higher sublimation rate and lower de composition rate than
2.Copper CVD precursor used in the deposition of copper films with low carbon content
References:
1.J.Mater. Res.. 1998. 13, 687
2.Surface and Coating Technology, 2002, 150, 205.
