FIB (Focused Ion Beam) 聚焦离子束技术为芯片研发和芯片制造分析过程提供了至关重要的辅助支持。它的基本原理是静电透镜聚焦的高能量金属离子 , 经高压电场加速后撞击试片表面,在特定气体协作下产生图像并移除或沉淀( 连接) 物质。该技术广泛应用于掩模修正、电路修改和失效分析。
百灵威供应多种 FIB 深层微沉积高纯有机金属源,助力研发与生产。
品名 | CAS | 货号 |
---|---|---|
(Trimethyl)pentamethylcyclopentadienylplatinum(IV), 99% (三甲基)五甲基环戊二烯基铂 , 99% | 97262-98-1 | 78-1358 |
(Trimethyl)methylcyclopentadienylplatinum(IV), 99% (三甲基)甲基环戊二烯合铂(IV) , 99% | 94442-22-5 | 78-1350 |
(Trimethyl)cyclopentadienylplatinum(IV), 99% π-环戊二烯(三甲基)铂 , 99% | 1271-07-4 | 78-1300 |
Tris(dibenzylideneacetone)platinum(0), min. 98% 三(二亚苄基丙酮)铂(0) 98% , min. 98% | 11072-92-7 | 78-1360 |
Platinum(II) acetylacetonate, 98% 乙酰丙酮铂 , 98% | 15170-57-7 | 78-1400 |
Platinum(II) hexafluoroacetylacetonate, 98% (99.9%-Pt) 1,1,1,5,5,5-六氟乙酰丙酮铂(II) , (99.9%-Pt) | 65353-51-7 | 78-1550 |
(Trimethyl)methylcyclopentadienylplatinum(IV), 99% (99.999%-Pt) (三甲基)甲基环戊二烯基铂(IV),99%(99.999%-Pt) | 94442-22-5 | 98-1350 |
(Trimethyl)methylcyclopentadienylplatinum(IV), 99% (三甲基)甲基环戊二烯基铂(IV) , 99% | 94442-22-5 | 98-4024 |
(Trimethyl)methylcyclopentadienylplatinum(IV), 99% (三甲基)甲基环戊二烯合铂(IV) , 99% | 94442-22-5 | 98-4026 |
Platinum powder, 99.95% 铂粉 , 99.95% | 7440-06-4 | 910751 |
品名 | CAS | 货号 |
---|---|---|
Tungsten hexacarbonyl, 97% 六羰基钨 | 14040-11-0 | C22104 |
Tungsten(VI) oxychloride, 98% 氧代氯化钨(VI) , 98% | 13520-78-0 | 74-3180 |
Bis(t-butylimido)bis(dimethylamino)tungsten(VI), min. 97% BTBMW 双(叔丁基亚氨基)双(二甲基氨基)钨(VI) , min. 97% | 406462-43-9 | 74-1225 |
Tungsten(VI) oxychloride, 98% 氧代氯化钨(VI) , 98% | 13520-78-0 | 74-3180 |
品名 | CAS | 货号 |
---|---|---|
Bis(mu-dimethylamino)tetrakis(dimethylamino)digallium, 98% 双(μ-二甲氨基)四(二甲氨基)镓, 98% | 57731-40-5 | 31-2030 |
Tris(2,2,6,6-tetramethyl-3,5-heptanedionato)gallium(III), 99% (99.999%-Ga) [Ga(TMHD)3] PURATREM 三(2,2,6,6-四甲基-3,5-庚二酮酸)镓(III) , (99.999%-Ga) | 34228-15-4 | 31-5000 |
Gallium(III) acetylacetonate (99.99+%-Ga) PURATREM 乙酰丙酮镓 , (99.99+%-Ga) | 14405-43-7 | 93-3130 |