全部
(99.5%)
(99.6+%)
(99.7%)
(99.8%)
(99.97%)
(99.99%)
(99.99+%)
100 μg/mL in Water, tr Hydrofluoric acid
1000 μg/g in 75 cSt Base oil
1000 μg/mL in Water, tr Hydrofluoric acid
10000 μg/mL in Water, tr Hydrofluoric acid
20%
5000 μg/g in 75 cSt Base oil
94%
99.6+%
99.8%
99.975+%
99.99+%
crystalline, 5-10?mm, ≥99.99% trace metals basis (purity exclusive of Na and K c
evaporation slug, diam. × L 6.3?mm × 6.3?mm, ≥99.99% trace metals basis
foil, thickness 0.025?mm, 99.98% trace metals basis
foil, thickness 0.05?mm, 99.99% trace metals basis
foil, thickness 0.1?mm, 99.99% trace metals basis
foil, thickness 0.127?mm, ≥99.99% trace metals basis
foil, thickness 0.127?mm, 99.7% trace metals basis
foil, thickness 0.25?mm, 99.7% trace metals basis
foil, thickness 0.25?mm, 99.99% trace metals basis
foil, thickness 0.5?mm, 99.99% trace metals basis
foil, thickness 2.0?mm, 99.7% trace metals basis
powder, ?100?mesh, 99.7% trace metals basis
powder, <45?μm avg. part. size, 99.98% trace metals basis
rod, diam. 6.35?mm, 99.7% trace metals basis
rod, diam. 6.35?mm, 99.99% trace metals basis
sponge, 3-19?mm, 99.5% trace metals basis
sputtering target, diam. × thickness 2.00?in. × 0.25?in., 99.995% trace metals b
sputtering target, diam. × thickness 3.00?in. × 0.125?in., 99.995% trace metals
wire, diam. 0.127?mm, 99.99% trace metals basis
wire, diam. 0.25?mm, 99.7% trace metals basis
wire, diam. 0.5?mm, 99.99% trace metals basis
wire, diam. 0.81?mm, 99.7% trace metals basis
wire, diam. 1.0?mm, 99.99% trace metals basis
wire, diam. 2.0?mm, 99.99% trace metals basis