全部
(93-96%)
(99.3%)
(99.5%)
(99.5+%)
(99.6+%)
(99.7%)
(99.8%)
(99.9% REO)
(99.9%)
(99.9+%)
(99.95%)
(99.97%)
(99.98%, Nb-25ppm)
(99.98%)
(99.99%)
(99.99+%)
(99.995%)
(99.9985%)
(99.999%)
(99.9999%)
(99%)
(99+%)
≥95% (boron), amorphous powder
≥99%, powder (fine)
98%
99.5%
99.5+%
99.8%
99.9%
99.95%
99.98%
99.99%
99.99% trace metals basis
99.995%
99.999%
99.999% trace metals basis
99.9995% trace metals basis
99.9999%
99.99999%
99%
average pore diameter 100??±10?? (typical), >99.95% trace metals basis
chips, 99.98% trace metals basis
crystalline, 1?cm, 99.7% trace metals basis
flakes
foil, thickness 0.05?mm, ≥99.9% trace metals basis
foil, thickness 0.1?mm, ≥99.9% trace metals basis
foil, thickness 0.127?mm, ≥99.9% trace metals basis
foil, thickness 0.25?mm, ≥99.9% trace metals basis
foil, thickness 0.25?mm, ≥99.99% trace metals basis
foil, thickness 0.5?mm, ≥99.9% trace metals basis
granular, ?5-+50?mesh, 99.99% trace metals basis
granular, 10-40?mesh, >99.99% trace metals basis
ingot, 99.999% trace metals basis
min. 97%
N/A
nanofibers, O.D. × I.D. × L 200-500?nm × 1-10?nm × 10-40?μm, 95% trace metals ba
nanopowder, <500?nm particle size (DLS), >99.95% trace metals basis
nanopowder, 35-45?nm particle size, 99.5% trace metals basis
pellets, <4?mm, ≥99.99% trace metals basis
pellets, <5?mm particle size, ≥99.999% trace metals basis
pieces, 99.999% trace metals basis
platelet nanofibers, D × L 50-250?nm × 0.5-5?μm, 98% carbon basis
powder (monocrystalline), 0.6-1?μm, ≥99.9% trace metals basis
powder, ?100?mesh, ≥99.5% trace metals basis
powder, ?200?mesh, 99.8% trace metals basis
powder, ?30?mesh, 99.997% trace metals basis
powder, ?325?mesh, 97%
powder, ?325?mesh, 99% trace metals basis
powder, <150?μm, 99.99% trace metals basis
powder, <45?μm, ≥99.99%
powder, 10?μm, ≥99.99% trace metals basis
powder, 12?μm, 99.9% trace metals basis
puriss. p.a., carbonyl-Iron powder, low in magnesium and manganese compounds, ≥9
rod, diam. 4.0?mm, 99.99% trace metals basis
rod, diam. 6.3?mm, 99.98% trace metals basis
rod, L 150?mm, diam. 3?mm, low density, 99.999% trace metals basis
rod, L 150?mm, diam. 6?mm, 99.999%
shot, 1-2?mm, 99.999% trace metals basis
sputtering target, diam. × thickness 2.00?in. × 0.25?in., 99.95% trace metals ba
wafer (single side polished), contains phosphorus as dopant, <111>, N-type, diam
wire, diam. 0.25?mm, ≥99.9% trace metals basis
wire, diam. 0.5?mm, ≥99.9% trace metals basis
wire, diam. 1.0?mm, ≥99.9% trace metals basis
wire, diam. 1.0?mm, ≥99.99% trace metals basis
wire, diam. 1.0?mm, 99.99% trace metals basis